Parameter | Specification |
---|---|
Layers | 4 Layers |
Board Thickness | 1.6 mm |
Dimensions | 83 × 68.9 mm |
Vias | Covered with solder mask |
Solder Mask | Black |
Silkscreen | White |
Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
Copper Thickness | 1/1 OZ |
Material | FR-4 |
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